Alongside the launch of the new Vision branding of notebooks, AMD has also updated it's "Congo" platform which is AMD's ultrathin notebook platform. They key difference between the two is that AMD has upgraded the integrated chipset to feature a 780G-series solution, rather than the ageing 690E used in the first generation of the platform.

Another major part of the overhaul is more dual core processors with both Athlon Neo X2 and Turion Neo X2 processors being available. Hopefully AMD has managed to constrain the heat output of these CPU's while adding a needed boost in performance.

The upgraded "Congo" platform should prove to be an interesting competitor against Intel's CULV platform, although we have a feeling we won't see quite as thin and light notebooks based on the AMD platform, at least not until AMD shrinks its die size to 45nm on its mobile processors.

AMD has yet to unveil any new CPU specifications for the improved "Congo" platform, but hopefully that information will become available shortly and we'll make sure to keep you up to date as and when it happens.